News Article
European 300mm Wafer Fab Buys Copper Technology
NuTool has delivered its 300mm LuminaCu integrated system to "a leading European semiconductor manufacturer". The tool is configured with the companys patented Electrochemical Mechanical Deposition (ECMD) and Reverse Linear CMP (RL-CMP) process modules for Cu damascene technology development at the 65nm technology node and beyond.
NuTool has delivered its 300mm LuminaCu integrated system to "a leading European semiconductor manufacturer". The tool is configured with the companys patented Electrochemical Mechanical Deposition (ECMD) and Reverse Linear CMP (RL-CMP) process modules for Cu damascene technology development at the 65nm technology node and beyond.
"We are pleased to have fulfilled our commitments to our customer, and are proud to be the only equipment supplier delivering the first of its kind integrated Cu plating and CMP system to customers," says Homayoun Talieh, CEO and founder of NuTool.
The LuminaCu system is aimed at copper/ultra-low-k integration on a 300mm platform. The company claims up to 60 wafers per hour throughput for typical Cu CMP applications and for Cu plating applications up to 90 wafers per hour.