Scotland Builds Optoelectronic Packaging Centre
Processes will be developed to align delicate circuitry to optical fibres and electronic connections. Solutions that can be transferred to other emerging technologies such as biochips for diagnosis and treatment of illness will also be sought.
The centre is being developed in conjunction with the Scottish Optoelectronics Association industry body and is designed to assist in bridging the gap between design and manufacturing qualification of optoelectronic devices. Funding comes from both Scottish Enterprise and the European Regional Development Fund.
The facility will also provide environmental test, reliability and qualification services to address specific challenges of clients.
No.5 China 300mm wafer fab takes up European 0.11micron technology
Infineon Technologies and China's Semiconductor Manufacturing International have signed an agreement to expand co-operation on production of standard memory (DRAMs). Under the terms of the additional agreement, Infineon will transfer its 0.11micron DRAM trench technology and 300mm wafer know-how to SMIC. In return, SMIC will manufacture products in this technology exclusively for Infineon.
Infineon expects to increase its overall capacity by 15,000 wafer starts per month through SMIC's 300mm plant, which is currently being built in Beijing. In December 2002, the two companies signed an agreement whereby SMIC would manufacture memory chips in its 200mm plant in Shanghai using Infineon's 0.14micron DRAM trench technology exclusively for Infineon. Following ramp-up at Beijing, the additional 300mm wafer starts to the 20,000 in 200mm will result in a total capacity of 58,000 wafer starts in 200mm wafer equivalents. First products from the new 300mm plant are expected for summer 2004.
