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Thursday 20th February 2003
Infineon Technologies and Saifun Semiconductors of Israel have set up Infineon Technologies Flash GmbH & Co. KG to develop Flash memory products. The joint venture has plans to integrate DRAM and Flash expertise. Infineon Flash stems from the Ingentix joint venture set up in 2001 by Infineon and Saifun. Infineon now holds 70% of the joint venture with headquarters in Dresden, Germany. As a result it is expected that 40 new jobs will be created in the area.
Thursday 20th February 2003
DRAM companies have been announcing chips and modules compliant with the double data rate 400Mbits/sec (DDR400) specification. Among the chip manufacturers with DDR400 products are Germanys Infineon Technologies, South Koreas Samsung and Hynix and Japans Elpida (former joint venture of NEC and Hitachi).
Thursday 20th February 2003
Researchers from Munich-based universities and from German chemical company Covion have developed a class of electroluminescent (EL) polymers that can be patterned in a way similar to standard lithography photoresists (Nature, February 20, 2003). In other words, the polymer is spin coated onto a substrate and then photographically patterned and processed.
Wednesday 19th February 2003
Shipley opened a $30mn advanced technology centre in Massachusetts dedicated to the development of lithography, interconnect, low-k dielectric and other critical materials needed to produce the newest generations of microelectronic devices.
Wednesday 19th February 2003
SEMIs book-to-bill ratio for North American semiconductor equipment suppliers was 0.92 in January 2003 (preliminary).
Wednesday 19th February 2003
The organic semiconductor segment is poised for rapid growth over the next five years. This comprehensive study evaluates the commercial prospects for organic semiconductors, based on a realistic understanding of the technical capabilities of these materials, and identifies many new and exciting opportunities for semiconductor manufacturers and suppliers, as well as print machinery and polymer developers. This report seeks to separate real growth opportunities from hyperbole, analysing the technical and market challenges facing organic semiconductor devices and new opportunities for suppliers. It combines a comprehensive assessment of secondary data with a major new primary research survey of industry leaders to produce the most comprehensive study of the emerging organic semiconductor market to date. ***CLICK ON OUR MAIN ADVERT AND DOWNLOAD A COPY OF THE BROCHURE WITH FULL CONTENTS LISTING AND ORDER FORM*** About Pira International Pira International is an independent publishing house, conference organiser and research organisation specialising in graphic arts, media and technology-led industries. Pira was established over 70 years ago and is based just outside London. Our market reports are based on extensive primary research projects and provide customers with quantitative market forecasts and value-added analysis.
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Wednesday 19th February 2003
Intel plans to convert its 200mm Fab 12 to 300mm production. The facility is located in Arizona. Costs for the conversion project are estimated at $2bn. Construction work is due to begin in H1 2004 with production scheduled for late 2005. The converted fab will start up production on 65nm process technology.
Wednesday 19th February 2003
German company Singulus Technologies has launched a thin-film sputtering system aimed at production of magnetic RAM on 300mm wafers.
Wednesday 19th February 2003
University of California Santa Barbara scientists (Nature, February 6, 2003) have developed a photovoltaic device based on a Schottky diode structure (metal-semiconductor rather than semiconductor-semiconductor junction).
Wednesday 19th February 2003
International SEMATECH (ISMT) plans to co-ordinate industry-wide studies into the extension of chrome as mask absorber, other materials that could replace it and the economic impacts of both pathways.
Wednesday 19th February 2003
Osram Opto Semiconductors has produced its first optical pumped semiconductor (OPS) disk laser prototype. The company says that for the first time its developers have achieved an 8W optical output power with an optical pumping power of 19W at a wavelength of 980nm.
Tuesday 18th February 2003
Agilent Technologies has agreed to buy the intellectual property and certain other assets of Pixel Devices International, a developer of complementary metal oxide semiconductor (CMOS) image sensors. Upon the close of the transaction, Pixels key employees will join Agilents Semiconductor Products Group, including PDIs chief technical officer Boyd Fowler.
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Tuesday 18th February 2003
Epitaxial wafer foundry IQE is to cut a further 60 jobs from its staffing, bringing the total to 250. The majority of the redundancies will be at IQE (Europe). The company reports that sales revenues for Q4 2002 are likely to be approximately 5% below the GBP5.6mn reported in the previous quarter.
Tuesday 18th February 2003
Toshiba has developed high-frequency silicon germanium (SiGe) RF transistors that achieve a 0.52dB noise level - the lowest currently available in a SiGe transistor, it is claimed. The transistors are produced on an expitaxial bipolar process.
Tuesday 18th February 2003
Fairchild Semiconductor will supply US optical networking supplier OMM with micro-electro-mechanical system (MEMS) wafers under a long-term production agreement. OMM produces MEMS-based all-optical switching modules.
Tuesday 18th February 2003
Samsung Electronics has become a new shareholder in the Symbian operating system (OS). The OS is designed for handheld devices and was originally developed for the Psion electronic organiser. Since then Symbian has been promoted for smartphones, with backing from companies such as Nokia, Ericsson/Sony Ericsson and Motorola.
Tuesday 18th February 2003
STMicroelectronics has developed a three-axis linear accelerometer aimed primarily at applications in handheld terminals. The device combines a micro-electro-mechanical system (MEMS) sensor and an interface chip in a single package.
Friday 7th February 2003
IC Insights is forecasting an average annual growth rate for the compound semiconductor IC market of 22% for the period 2002-2007. The expectation for the total IC market is 10% for the same duration.
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Friday 7th February 2003
Microsystem producer Corning IntelliSense and Northrop Grumman’s Electronic Systems sector are collaborating on a US Air Force Research Laboratory/ Defense Advanced Research Projects Agency (AFRL/DARPA) sponsored programme on RF MEMS (micro-electro-mechanical system) improvement.
Thursday 6th February 2003
An IC design and software development centre has been set up in Rabat, Morocco, by STMicroelectronics. The decision to set up the centre expands on ST’s existing Moroccan presence from package, assembly and test.
Thursday 6th February 2003
X-FAB has released a new technology for inertial sensors from its new micro-electro-mechanical systems (MEMS) surface micromachining process on SOI wafer process generation.
Thursday 6th February 2003
University of California Santa Barbara scientists (Nature, February 6, 2003) have developed a photovoltaic device based on a Schottky diode structure (metal-semiconductor rather than semiconductor-semiconductor junction).
Thursday 6th February 2003
Infineon Technologies is to make seven presentations to the International Solid-State Circuits Conference (ISSCC 2003) next week (February 9-13, 2003) in the USA. Infineon’s topics include bio-sensor array chips, flexible organic circuits and smart textiles. The company is also presenting new developments in high-speed communications chips (SiGe and CMOS), and the results of two joint research projects in memory chip design (ferroelectric RAM and SRAM).
Wednesday 5th February 2003
The European Unions Competitiveness Council has agreed the creation of a Community Patent, based on a compromise from the Greek presidency. Discussions go back to 1975 when member states signed the "Luxembourg Convention". As reported earlier (February 28, 2003), one of the main differences concerned whether a central patent court would be established.

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