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Wednesday 1st January 2003
Aneric is to be exclusive distributor in Asia for German company iCADA, a producer of reticle management solutions. Aneric has already supported the first installation of an iCADA system in December 1999 at a Singaporean customer.
Wednesday 1st January 2003
JSR Micro is to officially open its new manufacturing plant in Leuven, Belgium, on the November 20, 2002. The plant will focus on the production of advanced deep ultraviolet (DUV) photoresists and developers.
Wednesday 1st January 2003
IMEC is setting up a 300mm silicon research platform initiative. The aim is to perform advanced process research at least two generations ahead of manufacturing. IMEC's local Flemish government will provide funding of EUR37.18mn for the cleanroom construction.
Wednesday 1st January 2003
STMicroelectronics' first 0.13micron Flash memories are being supplied in engineering sample quantities. Ramp to volume will begin in Q4, 2002. The devices were developed at ST's Center of Excellence for Non Volatile Memories in Agrate, Italy.
Wednesday 1st January 2003
IBM has a newly-developed, high-performance microprocessor - the 64-bit PowerPC 970 derived the POWER4 server processor. The new chip is aimed at the desktop, low-end server and pervasive markets.
Wednesday 1st January 2003
Harvard Univeristy chemists believe they have developed a previously unknown catalytic mechanism that can grow nanolaminates at the rate of 32 monolayers per cycle (Science, October 11, 2002). The authors see this as a
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Wednesday 1st January 2003
Wacker has decided on a new production location for 300mm silicon wafers - Freiberg, Germany. From August 2004, the initial capacity will be 60,000 wafers per month. This could ultimately increase to 150,000 per month. The EUR430mn investment could create more than 600 new jobs. President/CEO Dr Peter-Alexander Wacker says:
Wednesday 1st January 2003
Chartered Semiconductor Manufacturing closed its eight-for-ten rights offering. The company expects to issue a total of 1.1bn new ordinary shares. As expected, gross proceeds from the offering were SGD1.11mn, translating to approximately $620mn.
Wednesday 1st January 2003
Philips Electronics is to dissolve its Components division. Telecom speaker activity will be combined with Mobile Display Systems (MDS) and moved to Philips Semiconductors, offering a single source for the telecom and PDA markets. Digital display and wireless activities will move to Philips Consumer Electronics.
Wednesday 1st January 2003
SZ Testsysteme's managing board has filed for bankruptcy. Negotiations with banks have not led to a satisfactory outcome with regard to a sufficient financing framework despite far-reaching agreements with key suppliers and employees.
Wednesday 1st January 2003
Bookham Technology has agreed to acquire the Optical Transmitter and Receiver and Optical Amplifier businesses of Nortel Networks. As part of the combination, Nortel Networks has also agreed to enter into a $120mn supply agreement with Bookham. Approval of the deal by Bookham's shareholders is need at an extraordinary general meeting to be held on November 5, 2002.
Wednesday 1st January 2003
AMD and Fujitsu are discussing integration of their Flash memory operations, according to Financial Times. This would create a Flash operation larger than Intel's, the current world leader in the technology.
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Wednesday 1st January 2003
Tower Semiconductor will use New Vision Systems' ARGUS lithography advanced process control (APC) technology in the 200mm Fab 2. This facility will produce Flash memory and CMOS image sensor devices using several advanced methods, such as field stitching, which challenge conventional APC systems. ARGUS supports real-time monitoring and feedback control of high volume patterning processes.
Wednesday 1st January 2003
Metron Technology and FSI International announced early termination of distribution agreements in Europe and the Asia-Pacific region, with a closing date effective March 1, 2003. From that date, FSI will assume direct sales, service and applications support and logistics responsibilities for its surface conditioning and microlithography products in Europe and the Asia-Pacific region. Metron will continue to represent FSI products in Israel. m.FSI, a joint venture between FSI and Mitsui, will continue to represent FSI products in Japan.
Wednesday 1st January 2003
An Aixtron AIX 2400 MOCVD system in 8x75mm configuration is in operation at Seiko Epson for the production of GaInAsN materials. The company is researching long-wavelength lasers based on the technology.
Wednesday 1st January 2003
An agreement has been made between Taiwan's UMC foundry and IMEC's Europractice IC Service. The agreement offers access to UMC's Silicon Shuttle multi project wafer (MPW) platform for prototyping and production. Included are the most advanced technologies for low-volume production, such as 0.13micron CMOS logic and mixed-mode/RF, and low-cost prototyping.
Wednesday 1st January 2003
Smartcard shipments to the US and Canada for H1 2002 were 31.2mn cards - more than double the same period last year - according to research announced at the Smart Card Alliance annual conference. The study was conducted by accounting and tax firm KPMG for the Smart Card Alliance. Of the total, microprocessor cards accounted for 25.0mn, up 87% from a year earlier. Memory card shipments jumped to 6.2mn, more than a threefold increase.
Wednesday 1st January 2003
TSMC achieved 37.0% year-on-year growth to revenues of TWD12.755bn and UMC managed a 43.8% increase to TWD6.015bn.
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Wednesday 1st January 2003
TSMC achieved 37.0% year-on-year growth to revenues of TWD12.755bn and UMC managed a 43.8% increase to TWD6.015bn.
Wednesday 1st January 2003
Hynix Semiconductor Europe has received binding agreements from two UK distributors to cease and desist from importing and marketing counterfeit Hynix memory chips, The two distribution companies are called Rombyte and First Choice Components. Hynix Semiconductor Europe agreed to an out of court settlement with the two distributors. The companies will destroy any remaining stock and provide Hynix with full details of the suspected suppliers of the fake products.
Wednesday 1st January 2003
STMicroelectronics claims a US district court has ruled in its favor in connection with a patent infringement lawsuit filed against it by Power Mosfet Technologies in August 1999. The ruling finds that any product incorporating ST's MDmesh technology, including STMicroelectronics' family of MDmesh Power MOSFET devices, does not infringe the relevant US patent (No.5,216,275).
Wednesday 1st January 2003
Intel's Itanium-based products infringe two patents owned by Intergraph, according to a ruling from a US district court in Texas. The patents involved define key aspects of parallel instruction computing (PIC). The judge ruled that the patents are
Wednesday 1st January 2003
Taiwan foundry UMC has won a ruling against Taiwan's Silicon Integrated Systems (SiS) in an investigation at the US International Trade Commission (ITC). The SiS is illegally manufacturing products using a patented UMC process, according to the ruling. A Limited Exclusion Order directs the US Customs Service to bar US entry of all SiS products made with the infringing process.
Wednesday 1st January 2003
Corning has received a US patent for a calcium fluoride (CaF2) lens blank for 193nm and 157nm microlithography systems. The company says it can use the technique to produce blanks consisting of multiple adjoining abutting subgrains with low boundary angles.

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