Aneric is to be exclusive distributor in Asia for German company iCADA, a producer of reticle management solutions. Aneric has already supported the first installation of an iCADA system in December 1999 at a Singaporean customer.
JSR Micro is to officially open its new manufacturing plant in Leuven, Belgium, on the November 20, 2002. The plant will focus on the production of advanced deep ultraviolet (DUV) photoresists and developers.
IMEC is setting up a 300mm silicon research platform initiative. The aim is
to perform advanced process research at least two generations ahead of
manufacturing. IMEC's local Flemish government will provide funding of
EUR37.18mn for the cleanroom construction.
STMicroelectronics' first 0.13micron Flash memories are being supplied in
engineering sample quantities. Ramp to volume will begin in Q4, 2002. The
devices were developed at ST's Center of Excellence for Non Volatile
Memories in Agrate, Italy.
Harvard Univeristy chemists believe they have developed a previously unknown
catalytic mechanism that can grow nanolaminates at the rate of 32 monolayers
per cycle (Science, October 11, 2002).
The authors see this as a
Wacker has decided on a new production location for 300mm silicon wafers -
Freiberg, Germany. From August 2004, the initial capacity will be 60,000
wafers per month. This could ultimately increase to 150,000 per month. The
EUR430mn investment could create more than 600 new jobs. President/CEO Dr
Peter-Alexander Wacker says:
Chartered Semiconductor Manufacturing closed its eight-for-ten rights
offering. The company expects to issue a total of 1.1bn new ordinary shares.
As expected, gross proceeds from the offering were SGD1.11mn, translating to
Philips Electronics is to dissolve its Components division. Telecom speaker
activity will be combined with Mobile Display Systems (MDS) and moved to
Philips Semiconductors, offering a single source for the telecom and PDA
markets. Digital display and wireless activities will move to Philips
SZ Testsysteme's managing board has filed for bankruptcy. Negotiations with
banks have not led to a satisfactory outcome with regard to a sufficient
financing framework despite far-reaching agreements with key suppliers and employees.
Bookham Technology has agreed to acquire the Optical Transmitter and
Receiver and Optical Amplifier businesses of Nortel Networks. As part of the
combination, Nortel Networks has also agreed to enter into a $120mn supply
agreement with Bookham. Approval of the deal by Bookham's shareholders is
need at an extraordinary general meeting to be held on November 5, 2002.
AMD and Fujitsu are discussing integration of their Flash memory operations,
according to Financial Times. This would create a Flash operation larger
than Intel's, the current world leader in the technology.
Tower Semiconductor will use New Vision Systems' ARGUS lithography advanced
process control (APC) technology in the 200mm Fab 2. This facility will
produce Flash memory and CMOS image sensor devices using several advanced
methods, such as field stitching, which challenge conventional APC systems.
ARGUS supports real-time monitoring and feedback control of high volume
Metron Technology and FSI International announced early termination of
distribution agreements in Europe and the Asia-Pacific region, with a
closing date effective March 1, 2003.
From that date, FSI will assume direct sales, service and applications
support and logistics responsibilities for its surface conditioning and
microlithography products in Europe and the Asia-Pacific region. Metron will
continue to represent FSI products in Israel. m.FSI, a joint venture between
FSI and Mitsui, will continue to represent FSI products in Japan.
An Aixtron AIX 2400 MOCVD system in 8x75mm configuration is in operation at
Seiko Epson for the production of GaInAsN materials. The company is
researching long-wavelength lasers based on the technology.
An agreement has been made between Taiwan's UMC foundry and IMEC's
Europractice IC Service. The agreement offers access to UMC's Silicon
Shuttle multi project wafer (MPW) platform for prototyping and production.
Included are the most advanced technologies for low-volume production, such
as 0.13micron CMOS logic and mixed-mode/RF, and low-cost prototyping.
Smartcard shipments to the US and Canada for H1 2002 were 31.2mn cards -
more than double the same period last year - according to research announced
at the Smart Card Alliance annual conference. The study was conducted by
accounting and tax firm KPMG for the Smart Card Alliance. Of the total,
microprocessor cards accounted for 25.0mn, up 87% from a year earlier.
Memory card shipments jumped to 6.2mn, more than a threefold increase.
Hynix Semiconductor Europe has received binding agreements from two UK
distributors to cease and desist from importing and marketing counterfeit
Hynix memory chips, The two distribution companies are called Rombyte and
First Choice Components. Hynix Semiconductor Europe agreed to an out of
court settlement with the two distributors. The companies will destroy any
remaining stock and provide Hynix with full details of the suspected
suppliers of the fake products.
STMicroelectronics claims a US district court has ruled in its favor in
connection with a patent infringement lawsuit filed against it by Power
Mosfet Technologies in August 1999. The ruling finds that any product
incorporating ST's MDmesh technology, including STMicroelectronics' family
of MDmesh Power MOSFET devices, does not infringe the relevant US patent
Intel's Itanium-based products infringe two patents owned by Intergraph,
according to a ruling from a US district court in Texas.
The patents involved define key aspects of parallel instruction computing
(PIC). The judge ruled that the patents are
Taiwan foundry UMC has won a ruling against Taiwan's Silicon Integrated
Systems (SiS) in an investigation at the US International Trade Commission
(ITC). The SiS is illegally manufacturing products using a patented UMC
process, according to the ruling. A Limited Exclusion Order directs the US
Customs Service to bar US entry of all SiS products made with the infringing
Corning has received a US patent for a calcium fluoride (CaF2) lens blank
for 193nm and 157nm microlithography systems. The company says it can use
the technique to produce blanks consisting of multiple adjoining abutting
subgrains with low boundary angles.