At their recent visit to the Semitool facility in Cambridge, UK, the board of directors and members of JEMI UK Ltd celebrated the organisations 10th anniversary. At a ceremony organised for the occasion Chris Walker JEMI UK’s current Chairman commented “The organisation has gone a long way since its inception 10 years ago and we should acknowledge the support which we have received by companies who have supported us along the way
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Kopin claims record performance results for its advanced GAIN-HBT transistor wafers. The HBT transistors consist of an InGaP emitter layer and a GaAs collector layer, while the base layer is composed of four elements: Ga, As, In, and N. These devices enable lower voltage operation, higher DC and RF gain, and improved temperature stability compared to standard InGaP and AlGaAs HBTs.
Corning IntelliSense has been awarded a $2mn grant from the US Department of Commerce's Advanced Technology Program (ATP) to develop embedded digital interface and control circuits for micro-electro-mechanical systems (MEMS). The two-year programme will be funded with a total of $5.6mn.
Cambridge Display Technology (CDT) and Luxell Technologies are in dispute over a license agreement. Luxell is seeking damages in excess of $25mn for breach of contract. CDT failed to make a scheduled payment, it is claimed.
CDT signed an exclusive license agreement in November 2001 for Luxell's Black Layer technology for the global light emitting polymer (LEP) market (Bulletin 407, November 5, 2001), following earlier evaluation (Bulletin 383, May 21, 2001).
In-Stat/MDR is looking to 18.1% growth in the world semiconductor market next year, according to reports on the Silicon Strategies web site. The 2002 increase is expected to be a marginal 0.1% to $139.1bn. The 2004 growth rate is forecast at 35% to $214.3bn with the 2005 market reaching $242.2bn.
In May, In-Stat/MDR was expecting the market to decline 4-5% this year leading in to a 30.7% increase in 2003.
Intel reports Q3 revenues at $6.5bn, comparable with last year's figure. Net income was $686mn, a 547% increase on 2001. The company expects Q4 revenues in the range $6.5-6.9bn.
The other main PC processor maker AMD reports sales of $508mn in the quarter to September 29. Net losses were $254mn. The sales were 34% down on last year. Net losses in Q3 2001 were $187mn.
AMD says that its Q3 sales were adversely impacted by measures taken to align its supply chain for PC products to customer demand.
A new organic-thin film transistor (organic-TFT) technology on plastic substrates is to be developed as part of a federal US sponsored R&D initiative. The companies involved in the three-year National Institute of Standards and Technology's (NIST) Advanced Technology Program are DuPont and Sarnoff. Lucent Technologies' Bell Labs will be subcontracted to develop a new class of organic-TFT materials and design processes. Organic-TFTs could be used to produce full-colour polymer-based active matrix OLED (AM-OLED) displays.
STMicroelectronics and Fujitsu have teamed up to develop the ST19ZR01, claimed as the first contactless smartcard IC with ferroelectric memory (FRAM) and ROM, but no standard RAM. The demonstrator product includes an on-board library of certified cryptographic algorithms. ST will market the technology from Q4 2002.
STMicroelectronics says it has a ground-breaking technology that allows silicon-based light emitters to match the efficiency of traditional compound semiconductor materials such as gallium arsenide (GaAs). While silicon is an ideal material for building electronic circuits, it has an
Swiss analogue IC producer EM Microelectronic says it is ready to start producing fully depleted silicon-on-insulator (FD SOI) ICs. EM believes that its ICs are the first FD SOIs operating at a guaranteed voltage lower than 0.5V over the whole voltage and temperature range.
Cambridge Display Technology (CDT) has bought UK-based Opsys' business related to the intellectual property (IP), commercialisation and technology development of organic light emitting diode (OLED) displays.
Aixtron says it has demonstrated MOCVD processes for multi-wafer 200mm GaAs
substrates with outstanding performance for the first time ever, Extensive
numerical modeling enabled the existing AIX 2600 G3 reactor to be upscaled
for 200mm use. Substrates from Freiberger Compound Materials were used in
the demonstration. Uniformities at the 1% level are reported across the
entire 200mm wafer. Material quality and homogeneity do not differ from
results obtained on the well established 150mm systems. Already several AIX
2600G3 systems have been installed at customers for the production of SiGe
epi structures, using multiple 200mm substrates.
LSI Logic claims an industry first for copper/low-k processes in wire bond
packaging with it Pad on I/O process. This places bond pads directly on top
of active I/O circuits in a chip design. Pad on I/O was developed for LSI
Logic's Gflx (0.11micron) and G90 (90nm) silicon processes. The Pad on I/O
technology can reduce die areas by up to 50% when compared with standard
wire bond designs.
QinetiQ has launched a new deep reactive ion etch (RIE) silicon service. The
company says the service is the first phase of providing access to a
comprehensive, state-of-the-art silicon micro-electro-mechanical system
(MEMS) design and prototyping facility, under its INTEGRAM programme. Prices
and operational turnaround depend on the complexity and level of
customisation. The Europractice Manufacturing Cluster INTEGRAM (Integrated
Microsystems) programme was launched earlier this year with EUR1.3M of
European Commission funding.
Technologies and Devices (TDI) has demonstrated production of 50mm diameter
GaN templates with p-type electrical conductivity. GaN is the compound
semiconductor material used for the fabrication of blue spectrum (blue,
green, and ultraviolet and white) light emitting diodes (LEDs), laser diodes
(LDs) and high-frequency/high-power transistors. Up to now n-type GaN
material technology has seen progress, but lack of a cost effective thick
p-type material has hampered development and commercial availability of many
types of advanced devices.
Mondiaquartz officially opened its new industrial site at Bernin near
Grenoble, France. Mondiaquartz will use the site to produce products for the
manufacturing of high purity 300mm quartz wafers. The new production unit
has an annual production capacity worth more than EUR20mn in turnover. Among
other applications quartz is used for holding silicon wafers in position in
high-temperature heat treatment operations during diffusion phases.
Deep UV laser producer Cymer is to build a new 24,000m2 manufacturing
facility for high-volume production, including the recently unveiled XL
Series line, as part of a new business strategy. The XL sources use a
dual-gas-discharge-chamber Master Oscillator Power Amplifier (MOPA)
Cambridge Display Technology (CDT) has bought UK-based Opsys' business
related to the intellectual property (IP), commercialisation and technology
development of organic light emitting diode (OLED) displays.
CDT receives ownership of all rights to Opsys' dendrimer OLED technology and
assumes management of the commercial and technical development of Opsys'
business. More than 25 highly-skilled scientists from Opsys have been added
to CDT's staff.
TriQuint Semiconductor is to buy a substantial portion of Agere
Systems'optoelectronics business for $40mn in cash. The transaction includes
products, technology and some facilities. The products include lasers,
detectors, modulators, passive components, arrayed waveguide-based
components, amplifiers, transmitters, receivers, transceivers, transponders,
and MEMS (micro-electro-mechanical systems).