Toshiba has decided "in principle" to build 300mm wafer production
facilities. Production lines will be set up in two major Japanese facilities
in Oita and Yokkaichi. The investment programme will extend over four years
from 2003 and is expected to total JPY350bn.
The BOC Lienhwa joint venture in Taiwan has begun high purity ammonia production at its electronic materials plant for the semiconductor, liquid crystal display (LCD) and flat panel display (FPD) industries.
SEMI has calculated a preliminary book-to-bill ratio for North American semiconductor equipment makers of 0.79 in November 2002. The three-month average for orders were worth $779mn, a 39% improvement on 2001. Billings were at $991mn, up 21%.
Infineon Technologies and independent memory module manufacturer Kingston Technology have signed a long-term agreement (LTA) and a non-binding memorandum of understanding (MoU) concerning memory products.
US display integrator Three-Five Systems gained the right to market German optical device producer OSRAM Opto Semiconductors’ organic light emitting diode (OLED) displays. Three-Five Systems will also provide design-engineering services to support the integration of OSRAMs technology into OEM products.
Infineon Technologies has decided to sell its 30% share of the ProMOS Technologies DRAM joint venture with Mosel Vitelic. ProMOS has responded (December 16) by suing Infineon under Taiwan law for breach of fiduciary duty, other misconduct and the violation of company law, the criminal code and the securities and fair trade act. An Infineon spokesman was unwilling to comment on the ProMOS allegations given that his company had not been informed as yet by its lawyers of the legal action.
Alcatel Vacuum Technology is an acknowledged leader in vacuum pumps, helium leak detection and micromachining systems
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Helium leak detectors : Portable and console leak detectors - Dry leak detectors -
Leak detectors systems
Micro Machining Systems : ICP Plasma etching systems for MEMS
Alcatel Vacuum Technology employs 900 people throughout the world, with 650 located in France and 250 abroad.
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Toshiba has decided "in principle" to build 300mm wafer production facilities. Production lines will be set up in two major Japanese facilities in Oita and Yokkaichi. The investment program will extend over four years from 2003 and is expected to total JPY350bn.
Taiwan company WIN Semiconductors (WIN) and UK-based Roke Manor Research have made a "stategic alliance" combining GaAs processing and design capabilities to provide a complete solution from design to finished parts.
SZ Testsysteme creditors have decided to shut the business down. A creditors committee is currently considering a continuation of the operational business by a rescue company. In this regard there are two offers.
A leading European semiconductor manufacturer has placed an
order for NuTool’s integrated 300mm LuminaCu system.
The system is configured with patented electrochemical
mechanical deposition (ECMD) and reverse linear chemical
mechanical planarisation (RL-CMP) process modules for Cu
damascene development at the 65nm technology node and beyond.
The LuminaCu system delivers up to 60 wafers per hour for
typical Cu CMP applications. For Cu plating applications, the
LuminaCu ECMD system with its patented super planar deposition
technology delivers up to 90 wafers per hour. NuTool will ship the
system to the customer in Q1 2003.
Singapore foundry Chartered Semiconductor Manufacturing reports
improved expectations in Q4. Revenues, shipments and fab
utilisation levels are all set to be higher than previous guidance
(October 25, 2002) suggested.
Researchers from Agere Systems claim that electrical breakdown in
thin-film dielectrics is based on an uncorrelated build-up of defects
(Nature, November 28, 2002). This contrasts with thick films where
the presence of defects makes it easier for new ones to form
resulting in a catastrophic failure. The scientists compared
measurements on 100 FETs with an uncorrelated model and found
The draft Sixth Framework Program (FP6) information society
technologies (IST) research agenda for the European Union
contains plans for pushing the limits of CMOS and preparing for
post-CMOS and micro and nano system development. The draft is in
the process of European Commission adoption and is not a binding
This week is the International Electron Devices Meeting (IEDM), December 8-11, in San Francisco, California. We have presented some of the research already in previous weeks. Here are some details of work at STMicroelectronics, IBM and of collaboration at
Toshiba and Sony.