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Wednesday 1st January 2003
UMC reports Q2 net sales of TWD18.58bn resulting in net income of TWD4.45bn. These compare with net sales of TWD15.00bn and a net loss of TWD1.85bn in Q2 2001. The capital spending budget is to be cut from $1.6bn to $1.3bn
Wednesday 1st January 2003
Researchers at Infineon Technologies have developed a technique to solder different types of chip together to form a
Wednesday 1st January 2003
Actel and Infineon Technologies are to jointly develop Flash memory field-programmable gate array (FPGA) solutions for production in a 0.13micron process. The work will build on Actel's Flash-based ProASIC FPGA family and Infineon's process technology. New market segments will be investigated such as smartcards, automotive, industrial controls and mobile communications. The deal expands on a 1997 Flash process development and manufacturing agreement between the companies.
Wednesday 1st January 2003
Scientists at IBM and Nion R&D have improved the resolution to the sub-Anstrom level in electron microscopes by reducing aberration effects. The resolution performance is about 20 times the wavelength of the 120keV electrons. The team combined seven new sets of magnetic lens designed by computers to correct for spherical aberrations. The work was based on a VG Microscopes' HB501 STEM with the addition of a quadrupole-octupole aberration corrector. The four quadrupoles are separated by three octupoles. The researchers believe this is the smallest resolution achieved so far for direct electron imaging, although a posteriori processing of high energy electron scattering has resulted in higher resolution. High energy can result in beam damage of the target. The new microscope assembly was used to image gold atoms on a carbon substrate.
Wednesday 1st January 2003
The cornerstone for the Communicant Semiconductor Technologies fab development is to be laid this week (August 14) in Frankfurt (Oder), Germany. Chancellor Gerhard Schroeder is to attend. The company plans to be at the leading edge of the development of mixed-signal foundries with technology for truly modular carbon-doped silicon germanium and BiCMOS processing (Bulletins 372, February 12, 2001; 411, December 3, 2001; 423, March 11, 2002; 427, April 8, 2002; 437, June 17, 2002).
Wednesday 1st January 2003
Novellus Systems has agreed to buy all outstanding shares of SpeedFam-IPEC in a stock-for-stock merger. Novellus will also assume all of SpeedFam-IPEC's 6.25% Convertible Subordinated Notes due 2004, totaling $115mn. The transaction is valued at $220mn. Speedfam-IPEC produces chemical mechanical planarisation (CMP) systems. The acquired company will become a new product group for Novellus. SpeedFam-IPEC has worked with Novellus on copper interconnect processing as part of the Damascus Alliance. The transaction has been approved by the board of directors of both companies and is expected to formally close in Q4 2002 following SpeedFam-IPEC shareholder approval. Novellus shareholder approval is not required.
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Wednesday 1st January 2003
Novellus Systems has won an appeal court decision upholding its position in a lawsuit filed by Semitool on August 10, 1998, alleging patent infringement. Semitool claimed that Novellus' SABRE and SABRE xT copper deposition systems infringed its US patent Nos.5,222,310 and 5,337,708. The appeal court upheld a 2000 ruling that Novellus Systems had not violated the Semitool patents (Bulletin 329, April 3, 2000).
Wednesday 1st January 2003
Metron Technology and Cabot Microelectronics have modified their distribution agreement. Cabot Microelectronics will assume direct distribution of its products in Europe, Singapore and Malaysia effective from June 1, 2003. Metron will continue to distribute Cabot's products in Israel.
Wednesday 1st January 2003
SEMI released its wafer area shipment data for Q2. The total came to 0.821km2 (1.273bn square inches), a 29% improvement compared with 0.637km2 in 2001. The polished sector increased from 2001's 0.472km2 to 0.610km2. Expitaxial increased to 0.172km2 from 0.134km2. Area shares remained roughly constant at 74:21:5 (polished:epi:non-polished).
Wednesday 1st January 2003
BOC reports results for its semiconductor BOC Edwards business in the nine months to June 30, 2002, as GBP502.4mn turnover and GBP17.1mn operating profit. The result for the same period of 2001 was GBP689.4mn and GBP73.8mn, respectively. The Q3 results were GBP185.4mn turnover (GBP185.7mn in 2001) and GBP9.1mn operating profit (GBP13.6mn). The company reports
Wednesday 1st January 2003
Researchers at Oxford University's Physics Department have developed an improved version of their
Wednesday 1st January 2003
Intel revealed details of its new 90nm process, claimed as
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Wednesday 1st January 2003
German plasma etch equipment supplier ASYNTIS has raised EUR2mn in first round of financing with venture capital company Earlybird. Dr Berthold Kegel, CEO and co-founder of ASYNTIS, reports:
Wednesday 1st January 2003
Fujitsu Microelectronics has exercised its option to accelerate the sale of its Gresham wafer fab to Microchip Technology to August 2002. One of the remaining closing conditions is the qualification of the facility under Oregon's Strategic Investment Program. Microchip has made a definitive agreement to buy the Gresham semiconductor manufacturing facility from Fujitsu Microelectronics for $183.5mn (Bulletin 442, July 22, 2002).
Wednesday 1st January 2003
Communicant Semiconductor Technologies has named the company's chairman and co-founder, Dr Abbas Ourmazd, as interim CEO. This follows the resignation of Dr Klaus Wiemer (Bulletin 437, June 17, 2002). Ourmazd previously served as scientific director of the Innovations for High Per-formance microelectronics (IHP) organisation that supplies many of the leading edge process technologies for wireless and broadband communication to be used by Communicant. The company says it will be announcing additional senior appointments in the coming months.
Wednesday 1st January 2003
Ibis Technology has been granted a Korean patent for its MagScan magnetic scanning technology used in Ibis' oxygen implanters for SIMOX silicon on insulator (SOI) wafers. MagScan provides a method for scanning a high current beam quickly (150Hz) and with a very precisely controlled waveform. This technology enables improved uniformity in the final wafers.
Wednesday 1st January 2003
Singapore's Institute of Microelectronics (IME) has ordered an atomic layer deposition (ALD) system from US company Genus. The company is looking to reach a customer base of 12-14 by year-end. The IME is Genus' tenth customer. The tool will be used for advanced capacitor and gate dielectric applications and is scheduled to ship before year-end.
Wednesday 1st January 2003
Standard & Poor's semiconductor equipment equity analyst expects that chip-equipment industry order rates will decline in the second half of 2002, but that a recovery will resume in 2003.
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Wednesday 1st January 2003
Austrian cleaning toolmaker SEZ reports H1 net sales at EUR65.8mn, compared with EUR97.8mn in 2001. The net loss for the half year is EUR1.4mn. In 2001, a net profit of EUR15.4mn was made. Order intake increased to EUR74.1mn compared with EUR68.9mn, but backlog is down at EUR40.1mn from EUR61.9mn for the same time last year. The company management is assuming that there will be no
Wednesday 1st January 2003
Rockwell Scientific and UMC have successfully developed a readout integrated circuit (ROIC), the HAWAII-2RG, for the infrared detectors used by astronomy focal plane arrays (FPAs).
Wednesday 1st January 2003
Intense Photonics has closed a GBP10.5mn series B funding round. Cazenove Private Equity led the round with a syndicate containing first round investors, 3i and ACT Venture Capital, together with two further European venture capital funds, FNI Venture Capital and TTP Ventures. Intense Photonics will use the funds to accelerate the development of its product range and strengthen its marketing effort.
Wednesday 1st January 2003
As part of IQE's
Wednesday 1st January 2003
PDF Solutions is working with Israeli foundry Tower Semiconductor to achieve best-in-class yield and performance on a 0.18micron CMOS process. The work is to be carried out at Tower's new 200mm Fab 2 facility. PDF's technology aims at enabling quick analysis of the complex interactions between manufacturing processes and designs.
Wednesday 1st January 2003
August Technology has terminated its May 2002 purchase agreement with Semiconductor Technologies and Instruments (STI) (Texas) and ASTI Holdings Limited (Singapore) to acquire the Texas-based STI wafer inspection business. August Technology says it terminated the agreement

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