International SEMATECH (ISMT) and the State University of New York (SUNY)
University at Albany-SUNY (UAlbany) plan a joint five-year $320m programme
on next generation lithography. The letter of intent calls for negotiations
to start immediately on the formation of a strategic alliance - to be known
as International SEMATECH North (ISMTN) - to conduct R&D on advanced
lithography infrastructure for extreme ultraviolet (EUV) processes. The
programme would be managed by International SEMATECH and housed in UAlbany's
300mm wafer facility. A final agreement on the strategic alliance is hoped
for by the end of Q3 this year.
Philips Electronics is to sell its x-ray analytical business to UK-based
Spectris for a total amount of EUR150m. Completion of the transaction is
subject to customary consultation procedures with trade unions and works
councils and clearance by the competition authorities. The takeover is
expected to take place later this year. The business will be renamed
PANalytical as part of Spectris' Process Technology sector.
IBM has agreed to work with the packaging and assembly companies on its
latest Surface Laminar Circuit (SLC) flip chip substrate and packaging
development. Three companies apart from IBM are taking part - Amkor, ASAT
and ASE. These companies will be enabled to provide flip chip design and
assembly services. IBM will support their efforts with substrate design
along with electrical, mechanical and thermal modelling.
Wafer cleaning tool company SEZ Group has received an order worth CHF4.8m
for multiple spin-processors from a European 300mm consortium. The 304s will
be used for backside film removal and decontamination including bevel clean.
The tool orders are the first for SEZ from this fab. Delivery is scheduled
for the current business year.
Rambus has licensed its RaSer serial link technology to Intel for use in
Ethernet network applications. The Rambus RaSer 1-3.125Gbits/sec technology
includes hard macro physical layer interface cells that can be integrated in
ASIC or ASSP controller chips.
VLSI Research puts the global equipment market book-to-bill ratio at 1.24 in
June. Billings were at $2.56bn and bookings were at $3.17bn. May's
book-to-bill figure was 1.16 and the company is expecting 1.38 in July. For
IC sales, the market researchers have three-month average bookings at
$11.2bn and billings at $9.5bn for a ratio of 1.18. The July estimate is
1.50 ($14.5bn/$9.7bn). Front-end capacity utilisation is given as 83.0% in
May and 87.7%, with projections for 88.7% in July.
Infineon Technologies reports revenues of EUR1.4bn for the quarter ended
June 30, 2002. This represents a 10% increase on the previous year. Net
losses were EUR76m, an improvement on 2001's EUR371m. The company is
European silicon-on-insulator (SOI) wafer producer Soitec is in the process
of accepting the complete tool set needed to produce 300mm wafers at its
Bernin II facility in France. The toolset includes ion-implantation,
bonding, chemical-mechanical planarization (CMP) and metrology tools. Twelve
production lines with a capacity of 1.2mn wafer starts per year are planned
for installation at the new facility. These will be used for the production
of 300mm and 200mm SOI wafers. Production in this new, state-of-the-art
facility is expected to commence before the end of the year, with the first
line due for qualification in November.
KVH Industries has signed an agreement with ABB's High Voltage business to
cooperate in the development of a new fibreoptic current sensor. The
agreement follows a series of joint research projects during which the
companies explored the feasibility of using fibreoptics to measure current
in high-voltage power lines. The new fibreoptic sensors have been designed
for more accurate energy metering and wider bandwidth and improved safety
over conventional technologies.
DuPont has signed a definitive agreement to acquire ChemFirst for $408mn.
ChemFirst supplies electronic chemicals and materials to the semiconductor
industry. The company has 480 employees and primary manufacturing facilities
in Mississippi, Texas, Ohio, California, Scotland and Japan.
The semiconductor fabrication materials businesses include EKC Technologies
and ChemFirst Electronic Materials. ChemFirst's electronic materials
business segments will become a part of DuPont Electronic Technologies in
the DuPont Electronic & Communication Technologies sector.
EV Group (EVG) has completed installation and qualification of its automated
EVG 850 SOI production wafer bonding system at Analog Devices' SOI
(silicon-on-insulator) fab in Belfast, Northern Ireland. Analog Devices is
expanding its SOI wafer production capacity to meet demand for thick film
SOI wafers. Applications of the substrates include MEMS and power devices.
Vishay Intertechnology's Siliconix subsidiary and Fairchild Semiconductor
International have settled a US patent infringement lawsuit brought by
Siliconix against Fairchild.
The suit alleged that certain Fairchild products infringe two Siliconix
patents that relate generally to power trench metal-oxide-semiconductor
field-effect transistor (MOSFET) products. As part of the settlement,
Siliconix granted Fairchild a license to the two patents.
SEMI announced its preliminary book-to-bill ratio of 1.28 for the North
American semiconductor equipment industry in June. Bookings of $1.16bn were
up 59% up on June 2001. Billings were $906mn, down 33%. May's final
book-to-bill is 1.28.
The figures are now compiled by David Powell Inc, an
AMD, Infineon Technologies, and UMC plan to collaborate on the development
of common high-volume 65/45nm logic manufacturing platforms for 300mm
wafers. Initial work for the joint development program will take place at a
UMC facility in Hsinchu, Taiwan. With this initiative, Infineon expands upon
an existing agreement they have with UMC to develop 130/90nm process
technology and will join the process development programme AMD and UMC
announced earlier this year targeted for the 65nm and 45nm nodes.
Texas Instruments has a new silicon-germanium (SiGe) complementary
bipolar-CMOS manufacturing process (BiCom-III) that increases speeds up to
3x over other currently available complementary bipolar processes.
The new SiGe process is claimed as the industry's first to integrate both
NPN- and PNP-type bipolar transistors. This reduces noise by 50% noise for
operational amplifiers and other high-performance mixed signal products. The
process also used silicon-on-insulator (SOI) and deep trench isolation. The
0.4micron emitter NPN and PNP transistors are rated at 30kV and 10kV,
US magnetic memory developer Micromem has been approved for funding by a
non-profit research funding agency to support a proposed research
collaboration with a university.
The funding is conditional upon signing of a collaboration agreement among
Micromem, the agency and a university. Further, Micromem will have to match
the external funding. No shares will be issued.
IBM's 300mm semiconductor facility in New York state (East Fishkill) has
been opened. The $2.5bn investment will house both development and
manufacturing. Work on prototype customer designs has begun and the facility
is on-schedule to begin volume manufacturing later this year. The new
facility covers an area of 12,000m2 and is designed to support the creation
of chips with circuits smaller than 100nm.
MEMSCAP has agreed to buy substantially all of the business and assets of
JDS Uniphase's Cronos MEMS business unit. The French microsystems company
will be JDS Uniphase's exclusive supplier of MEMS-based products.
As part of the agreement, JDS Uniphase has provided MEMSCAP with initial
purchase commitments for products and services.
AMD, Fujitsu and Saifun Semiconductors have agreed to cross-license patents
and technology, settle all pending litigation and collaborate in the
development of future generations of non-volatile memory (NVM) technology.
As part of the collaboration, AMD and Fujitsu will also take an equity stake
Filtronic has closed the 75mm compound semiconductor fab at its US Filtronic
Solid State subsidiary in California. The operation will now run fablessly
using Filtronic's UK facility in Newton Aycliffe to produce devices. The UK
group is hoping the UK fab will break even by May 2003, dependent on the
success of its customer M/A-COM in the wireless handset switch market. The
failure of this opportunity would see Newton Aycliffe lose more than GBP1mn
a month for the rest of the financial year (to May 31, 2003).