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Monday 9th June 2008
India HP gains Microsoft MD. Neelam Dhawan now leads HP India.
Friday 6th June 2008
PARC to develop sensor tape technology to track exposure to explosive blasts. DARPA program builds on PARC foundation in printing large area, flexible electronics.
Friday 6th June 2008
Asia-Pacific represents exciting growth for all contact centre vendors
Thursday 5th June 2008
The Design For Manufacturability Coalition (DFMC) includes Takumi Technology as a new member.
Thursday 5th June 2008
The Design For Manufacturability Coalition (DFMC) includes Takumi Technology as a new member.
Thursday 5th June 2008
The Design For Manufacturability Coalition (DFMC) includes Takumi Technology as a new member.
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Thursday 5th June 2008
The Design For Manufacturability Coalition (DFMC) includes Takumi Technology as a new member.
Thursday 5th June 2008
The Design For Manufacturability Coalition (DFMC) includes Takumi Technology as a new member.
Thursday 5th June 2008
The Design For Manufacturability Coalition (DFMC) includes Takumi Technology as a new member.
Thursday 5th June 2008
The Design For Manufacturability Coalition (DFMC) includes Takumi Technology as a new member.
Thursday 5th June 2008
The Design For Manufacturability Coalition (DFMC) includes Takumi Technology as a new member.
Thursday 5th June 2008
The Design For Manufacturability Coalition (DFMC) includes Takumi Technology as a new member.
Info
Thursday 5th June 2008
The Design For Manufacturability Coalition (DFMC) includes Takumi Technology as a new member.
Sunday 2nd May 2004
IBM researchers (Science, May 2, 2003) have observed polarised infrared optical emission form a carbon nanotube ambipolar field effect transistor (FET).
Sunday 2nd May 2004
Palomar Technologies’ Process Development and Prototyping Services (PDPS) is to use the FeinFocus FOX-160.25MFT x-ray inspection system for the inspection of advanced components, materials and packaging technologies.
Friday 9th May 2003
Robert Bosch of Germany has ordered an Omega fxP cluster etcher from Trikon Technologies. The tool will be configured with Trikons M0RI, GPE gas phase chemical etching and DSi deep silicon etch modules. The fxP cluster etcher will be installed at Boschs Reutlingen fab that specialises in the manufacture of automotive sensors based on micro-electro-mechanical systems (MEMS).
Friday 9th May 2003
IBM researchers (Science, May 2, 2003) have observed polarised infrared optical emission from a carbon nanotube ambipolar field effect transistor (FET). Electrical measurements suggest that the emission arises from radiative recombination of electrons and holes simultaneously injected into the undoped nanotube.
Friday 9th May 2003
Isonics has successfully produced thin-film SOI wafers using an internally developed process. The company has accepted its first order for a lot of such wafers that is due to ship this month.
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Wednesday 7th May 2003
Infineon Technologies Emerging Technology Labs team has developed a fault-tolerant, self-organising embedded microcontroller network, which, coupled with sensors and LEDs, can be integrated into industrial or commercial textiles.
Wednesday 7th May 2003
The CellularRAM co-development team of Cypress Semiconductor, Infineon Technologies and Micron Technology announced availability of 32Mbit CellularRAM devices for wireless handsets. Samples are available in both asynchronous and burst modes.
Wednesday 7th May 2003
Strategic Marketing Associates (SMA) believes that some 36 new fab projects will likely get underway by Q2 2004. The projects include expansions, upgrades, additional fab lines and new construction.
Tuesday 6th May 2003
In-Stat/MDR expects an upturn in the semiconductor industry during H2 2003 resulting in 16.7% revenue growth to $164.2bn. Further growth is expected in 2004 and 2005 with 2006 beginning the next cyclical downturn.
Tuesday 6th May 2003
While International SEMATECH expects to be able to advance the maturity if low-k dielectrics in time for the industry’s modified schedule, the consortium’s interconnect director believes that new approaches will achieve even better results.
Tuesday 6th May 2003
Infineon Technologies plans to force the pace on its corporate restructuring for a "return to the profit zone and sustained success", according to Dr Ulrich Schumacher, Infineon’s president and CEO. The company has set up an "Impact(2)" as a follow-up to the Impact cost-cutting initiative launched in summer 2001, which led to savings amounting to EUR2.8bn. Impact(2) will optimise corporate processes and structures for further cost reductions of EUR500mn – with EUR50mn coming in the current fiscal year. The lion’s share will be financially effective on an earning before interest and tax (EBIT) basis in the next fiscal year. A major contribution will be made by relocation of individual business units as well as by outsourcing of various functions to external service providers.

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