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Wednesday 1st January 2003
Brooks-PRI Automation has signed a definitive agreement to acquire motion and machine control technology company Berkeley Process Control. The purchase will be in exchange for 614,374 Brooks-PRI shares. These shares are subject to adjustment depending upon the performance of Berkeley in the quarter ended December 31, 2002. The deal is expected to close by calendar year end. IMPORTANT EUROSEMI PLUS TRIALISTS IF YOU HAVE COME FROM THE EUROSEMI + NEWSLETTER AND WISH TO SEARCH THE REST OF OUR ARCHIVE OF BULLETINS PLEASE CLICK ON EUROSEMI PLUS LOGO IN RIGHT HAND CORNER OF THE WEBSITE AND THEN SELECT BULLETIN ARCHIVES PLEASE REMEMBER KEYWORD SEARCH CAN ALSO BE USED TO NAVIGATE ARCHIVES
Wednesday 1st January 2003
Robotic Vision Systems is exploring the sale of its Semiconductor Equipment Group and has started discussions with a number of interested parties. The Semiconductor Equipment Group has businesses covering 3-D inspection of assembled ICs and defects and wafer bump metrology. Discussions have not yet entered into the price negotiation stage.
Wednesday 1st January 2003
Tokyo Electron (TEL) is implementing reorganisation of its software development division on October 1, 2002. The operations of TEL's Advanced Software Engineering department will be transferred to Tokyo Electron Sapporo, a software development subsidiary. Further, the trade name and other corporate profiles of Tokyo Electron Sapporo will become Tokyo Electron Software Technologies.
Wednesday 1st January 2003
Intel has opened its microprocessor R&D centre in Barcelona, Spain. The Intel Labs Barcelona facility is sited at the Universitat Politecnica de Catalunya (Bulletin 435, May 30, 2002).
Wednesday 1st January 2003
Fairchild Semiconductor has opened a Package and Technology Knowledge Center in South Korea. The centre will research new packaging materials to improve thermal and mechanical performance and develop new assembly techniques.
Wednesday 1st January 2003
Nanomix has closed a $9mn Series B financing round led by Apax Partners and Sevin Rosen Funds. The company has integrated nanotube electronics on a four-inch silicon wafer and performed lab-scale prototyping of a high-density hydrogen storage system. The company plans to produce chemical sensors aimed at industrial gas leak detection, medical monitoring and industrial process control. The leak detection sensors are expected to reach the market in H2 2003. Nanomix is also developing high-density hydrogen storage alternatives for the emerging fuel cell industry.
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Wednesday 1st January 2003
Taiwan memory producers ProMOS Technologies and Powerchip Semiconductor are following TSMC's lead and have announced plans to build fabs in Mainland China (Bulletin 450, September 16, 2002). The Taiwan government has restricted the number to three fabs that can be built on the Mainland by its local companies before the end of 2005. The government is also demanding that Taiwan companies build 300mm on the island and run them at mass production levels before applying for Mainland investments.
Wednesday 1st January 2003
All the major obstacles to 157nm optical lithography have been overcome, was the striking claim to come out of the International Symposium on 157nm Lithography in Belgium.
Wednesday 1st January 2003
Samsung Electronics has announced its 90nm logic process technology, which will be used to fabricate high capacity memory chips. Samsung is claiming to be the first company to possess the technology for 90nm. There is a long list of other companies with 90nm in various stages of development (Bulletin 446, August 19, 2002).
Wednesday 1st January 2003
This year's winner of the European Semiconductor Start Up Award has quickly moved from strength to strength and is setting in motion events that are normally confined to more mature companies. David Ridsdale travelled to Dublin and discovered that common sense and a solid plan has provided Xsil with a solid beginning
Wednesday 1st January 2003
XinTec of Taiwan has ordered a full production line from EV Group (EVG), including an EVG 640 200mm production mask aligner and an EVG 150 automated resist coating system for advanced wafer level chip scale packaging (CSP).
Wednesday 1st January 2003
A EUR3.5mn research program devoted exclusively to OVPD (Organic Vapor Phase Deposition) technology for organic LED (OLED) display applications has been granted by the German Ministry of Research and Education to a group of researchers headed by Aixtron.
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Wednesday 1st January 2003
Lambda Physik is to invest up to EUR5mn until 2004 in the development of 157nm laser technology for microlithography. Up to 38% of the development and research expenses for the European 157nm microlithography consortion will come from the German Federal Ministry of Education and Research (BMBF).
Wednesday 1st January 2003
Philips Electronics and Fairchild Semiconductor have formed a working relationship to become a multi-source supplier for small-scale logic packaging.
Wednesday 1st January 2003
STMicroelectronics has two new tiny packages in its portfolio - the MSOP8 (meeting the TSSOP8 3x3mm JEDEC standard) and the 5x3mm MLP8 (VFQFPN8 JEDEC standard).
Wednesday 1st January 2003
Amkor Technology is expanding its MicroLeadFrame capacity to more than 75mn units/month by Q4, 2002. When introduced in 1999, the packages production reached a 1mn units/week three months after qualification.
Wednesday 1st January 2003
Soitec is expanding its R&D partnership with the Laboratoire d'Electronique de Technologies et d'Instrumentation (LETI) in Grenoble, France.
Wednesday 1st January 2003
Motorola has produced a single-chip assisted global positioning system (A-GPS) receiver small enough to fit into a wristwatch
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Wednesday 1st January 2003
Lambda Physik is to invest up to EUR5mn until 2004 in the development of 157nm laser technology for microlithography. Up to 38% of the development and research expenses for the European 157nm microlithography consortion will come from the German Federal Ministry of Education and Research (BMBF).
Wednesday 1st January 2003
A EUR3.5mn research program devoted exclusively to OVPD (Organic Vapor Phase Deposition) technology for organic LED (OLED) display applications has been granted by the German Ministry of Research and Education to a group of researchers headed by Aixtron.
Wednesday 1st January 2003
The Fabless Semiconductor Association (FSA) and JEDEC have produced a Foundry Process Qualification Guideline. The standard is the work of the FSA Foundry Process Qualification Subcommittee and the JEDEC JC-14.2 Wafer Level Reliability Committee.
Wednesday 1st January 2003
Isonics has established a thick-film silicon-on-insulator (SOI) wafer fabrication facility in Washington state.
Wednesday 1st January 2003
Silicon-on-insulator design specialist SOISIC (Silicon on Insulator Systems and Integrated Circuits) has produced CMOS/SOI-Xpert, claimed as the first commercially available characterisation product integrating all SOI structures.
Wednesday 1st January 2003
Device power rated at 30W and 60W have been released to production with 85W and 125W parts are targeted for released in October. Spectrian is currently in the process of completing system evaluation of these devices.

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