News Article
ASML Order Activity Has Slowed, According To Reports In The Financial Times.
ASML order activity has slowed, according to reports in the Financial Times.
Machines due to ship in H1 2003 have been hit by the scale back. ASML says
its customers are taking a
Advanced Semiconductor Engineering (ASE) has ordered 350 Maxum automatic
ball bonders from Kulicke & Soffa Industries. K&S expects to ship the
machines in the September and December 2002 quarters to an ASE semiconductor
assembly facility in Taiwan. The bonders will be used to make
ultra-fine-pitch, high-lead-count ball grid array (BGA) packages.
Amkor Technology is to become Agilent Technologies' virtual backend
operations and supply chain resource. Amkor will supply services that
include semiconductor package design, wafer bump process qualification, and
wafer bump and IC package assembly for high-performance application specific
integrated circuits (ASICs).
ST Microelectronics has awarded Flaekt Woods a contract to supply
ventilation solutions for a new $1.4bn research and development facility in
Crolles, France, which is to be used in the 90nm link-up with Motorola and
Philips. This research and development centre will incorporate a 300mm wafer
pilot line. Flaekt Woods is supplying 30 Europal fans (engineered
centrifugal fans), ranging in diameter from 1000mm to 1200mm, which are to
be used to exhaust different gases in the production facility.
Big Bear Networks has adopted silicon germanium (SiGe) process technology
from IBM Microelectronics for its forthcoming Photronic Signal Processing
(PSP) family of 10- and 40Gbit-per-second transponder and subassembly
products. The parts will be produced at IBM's Burlington VT facility.
Shipping of product is expected later this year.
The 10Gbit subassemblies and transponders are for long-haul applications and
the 40-gigabit transponders are for cross-office, metro core/inter-office
facility and long-haul transmission. Big Bear has been working with IBM for
the past 18 months to apply SiGe technology to its PSP designs. Big Bear has
already produced a number of operational 10- and 40Gbit devices based on the
process. Big Bear selected IBM's SiGe after evaluated various competing
process technologies, including indium phosphide (InP).
"In our early development phase we implemented several designs in both SiGe
and InP, initially believing that the inherently higher speeds of InP would
be required for high-performance 40G products," reports Dr John Paul Mattia,
Big Bear co-founder and chief technical officer. "However, after
side-by-side comparison, we found that SiGe not only produces circuits that
achieve the mandatory high performance, but also lets us easily integrate
the active intelligence needed to overcome fibre impairments."
Photonic telecom developer Transparent Networks has signed a MEMS foundry
services agreement with Silicon Microstructures (SMI), a wholly-owned
subsidiary of Germany's Elmos Semiconductor. Transparent Networks will
fabricate at SMI its MOEMS and MEMS components for integrated photonic
switches, including 3D mirror arrays, 3D fibre aligners and components for
photonic integrated circuits.
ball bonders from Kulicke & Soffa Industries. K&S expects to ship the
machines in the September and December 2002 quarters to an ASE semiconductor
assembly facility in Taiwan. The bonders will be used to make
ultra-fine-pitch, high-lead-count ball grid array (BGA) packages.
Amkor Technology is to become Agilent Technologies' virtual backend
operations and supply chain resource. Amkor will supply services that
include semiconductor package design, wafer bump process qualification, and
wafer bump and IC package assembly for high-performance application specific
integrated circuits (ASICs).
ST Microelectronics has awarded Flaekt Woods a contract to supply
ventilation solutions for a new $1.4bn research and development facility in
Crolles, France, which is to be used in the 90nm link-up with Motorola and
Philips. This research and development centre will incorporate a 300mm wafer
pilot line. Flaekt Woods is supplying 30 Europal fans (engineered
centrifugal fans), ranging in diameter from 1000mm to 1200mm, which are to
be used to exhaust different gases in the production facility.
Big Bear Networks has adopted silicon germanium (SiGe) process technology
from IBM Microelectronics for its forthcoming Photronic Signal Processing
(PSP) family of 10- and 40Gbit-per-second transponder and subassembly
products. The parts will be produced at IBM's Burlington VT facility.
Shipping of product is expected later this year.
The 10Gbit subassemblies and transponders are for long-haul applications and
the 40-gigabit transponders are for cross-office, metro core/inter-office
facility and long-haul transmission. Big Bear has been working with IBM for
the past 18 months to apply SiGe technology to its PSP designs. Big Bear has
already produced a number of operational 10- and 40Gbit devices based on the
process. Big Bear selected IBM's SiGe after evaluated various competing
process technologies, including indium phosphide (InP).
"In our early development phase we implemented several designs in both SiGe
and InP, initially believing that the inherently higher speeds of InP would
be required for high-performance 40G products," reports Dr John Paul Mattia,
Big Bear co-founder and chief technical officer. "However, after
side-by-side comparison, we found that SiGe not only produces circuits that
achieve the mandatory high performance, but also lets us easily integrate
the active intelligence needed to overcome fibre impairments."
Photonic telecom developer Transparent Networks has signed a MEMS foundry
services agreement with Silicon Microstructures (SMI), a wholly-owned
subsidiary of Germany's Elmos Semiconductor. Transparent Networks will
fabricate at SMI its MOEMS and MEMS components for integrated photonic
switches, including 3D mirror arrays, 3D fibre aligners and components for
photonic integrated circuits.
