News Article
EV Group (EVG) Has Completed Installation And Qualification Of Its Automated
EV Group (EVG) has completed installation and qualification of its automated
EVG 850 SOI production wafer bonding system at Analog Devices' SOI
(silicon-on-insulator) fab in Belfast, Northern Ireland. Analog Devices is
expanding its SOI wafer production capacity to meet demand for thick film
SOI wafers. Applications of the substrates include MEMS and power devices.
TSMC has selected Brooks-PRI Automation's Automated Material Handling System
(AMHS) to handle virtually every interbay wafer movement for its 200mm Fab 6
in Tainan, Taiwan. The equipment will be integrated with Brooks-PRI's PROMIS
Manufacturing Execution System (MES) software, which TSMC uses to monitor
and control the fab's overall manufacturing environment.
Honeywell Electronic Materials (HEM) and JSR have signed a Memorandum of
Understanding for the appointment of JSR as a non-exclusive worldwide
distributor for HEM's DUO inorganic bottom anti-reflective coatings (BARC).
The companies expect to complete formal arrangements within 90 days.
Discussions are underway for an agreement which would make Mitsubishi
Materials the sole supplier of copper to Honeywell Electronic Materials
(HEM).
(AMHS) to handle virtually every interbay wafer movement for its 200mm Fab 6
in Tainan, Taiwan. The equipment will be integrated with Brooks-PRI's PROMIS
Manufacturing Execution System (MES) software, which TSMC uses to monitor
and control the fab's overall manufacturing environment.
Honeywell Electronic Materials (HEM) and JSR have signed a Memorandum of
Understanding for the appointment of JSR as a non-exclusive worldwide
distributor for HEM's DUO inorganic bottom anti-reflective coatings (BARC).
The companies expect to complete formal arrangements within 90 days.
Discussions are underway for an agreement which would make Mitsubishi
Materials the sole supplier of copper to Honeywell Electronic Materials
(HEM).
