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DuPont Has Signed A Definitive Agreement To Acquire ChemFirst For 408mn.dollars

DuPont has signed a definitive agreement to acquire ChemFirst for $408mn. ChemFirst supplies electronic chemicals and materials to the semiconductor industry. The company has 480 employees and primary manufacturing facilities in Mississippi, Texas, Ohio, California, Scotland and Japan. The semiconductor fabrication materials businesses include EKC Technologies and ChemFirst Electronic Materials. ChemFirst's electronic materials business segments will become a part of DuPont Electronic Technologies in the DuPont Electronic & Communication Technologies sector.
The agreement must be approved by ChemFirst shareholders and is subject to
regulatory approval. The acquisition is expected to be completed in Q4 2002.

Rudolph Technologies has entered into a definitive agreement to acquire
ISOA, a defect control company based in Texas for $27.5mn. The deal is
expected to close within 90 days. ISOA is a spin-off from Texas Tech
University's International Center for Informatics Research (formerly the
Institute for Studies of Organizational Automation).
Over the past 16 years, ISOA has licensed its technology for use in the
semiconductor industry and recently began transitioning to a semiconductor
capital equipment supplier. The technologies are used in wafer macro defect
detection and classification.
Following the completion of the transaction, ISOA will continue to maintain
its offices in Richardson TX and will become the Yield Metrology Group of
Rudolph. Additionally, ISOA's tool manufacturing currently outsourced to
Japan will be moved to Rudolph's facility in New Jersey. ISOA has 40
employees.

ATMI has bought Microbar's Copper 2.0 delivery and waste recovery system
product line for advanced electrochemical deposition of copper. Copper 2.0
integrates high purity delivery to and safe recovery of spent material from
copper deposition tools.
Tom Talasek, senior product line director for ATMI, says: "The Copper 2.0
delivery system joins ATMI's CuChem copper bath analysis tool in our overall
strategy to create complete material management solutions, in this case, for
the copper electroplating process tool."
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