SEZ has received two volume orders for its spin-processor wafer cleaning systems within the last few weeks. The combined value of the orders is about CHF22.2m ($13.3m). The orders are for tools for the treatment of 200mm and 300mm wafers and are expected for delivery this year. One follow-on order came from a foundry in Singapore for the 200mm double chamber Spin-Processor 223. Orders for the 300mm Spin-Processor 304 came from the US.

Varian Semiconductor Equipment Associates has been awarded a $16m, five-year
service contract from a US chip company for complete service and support for
VIISta single wafer ion implanters at a 300mm fab.

Amkor Technology has ordered ASM Eagle gold wire ball bonders, following a
recent Letter of Intent and equipment shipment in April 2002. The new order
schedules delivery through June 2002. The bonders will be used at Amkor's
Korea facility.

Dielectric Systems has shipped its TP2200 low-k dielectric deposition tool
to an international consortium. The platform uses the company's FAR 2.2
(k=2.2) non-porous film. The film has a Young's modulus greater than 8GPa,
leakage current less than 5E-10A/cm2 @ 1MV/cm and thermal stability
exceeding 425C.

IDT (Integrated Device Technology) has bought New Vision System's ARGUS
advanced process control (APC) software to control lithography processing.
Deployment is underway at IDT's Hillsboro OR facility. ARGUS provides
real-time monitoring and feedback control of high volume patterning
processes.